尊龙时凯

21 November 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) and Intrinsic are launching a joint venture that will in partnership make the intelligent factory of the future a reality. AI-enabled robotics holds enormous potential for the manufacturing sector and how things are made on the factory floor, where operations need to be more flexible, adaptive and cost effective in the future. Specifically in electronics assembly – an industry experiencing massive growth with the AI boom, but also some of the most persistent robotics issues in manufacturing – there is ample opportunity to modernize production, and enable automation for an entirely new segment of the electronics market. There is more demand than ever in electronics manufacturing for the likes of server trays, GPUs and data centers – yet AI server manufacturing, for instance, is still a mix of rigid automation and manual production. The focus of the US-based joint venture will be achieving a step change in electronics assembly and manufacturing broadly. The goal will be to shift from product-specific automation solutions requiring significant re-engineering across product generations, to more general-purpose intelligent robotics – as well as automating previously manual processes, with the eventual goal of full factory orchestration and automation. Initially our collaboration will cover a range of critical use cases across assembly, inspection, machine tending and logistics applications. Intrinsic Flowstate, a web-based developer environment, will provide a common tool for Foxconn and Intrinsic teams to leverage industry- leading AI capabilities, such as the Intrinsic Vision Model (IVM) to automate newly possible solutions in electronics assembly. Young Liu, Chairman and CEO of Foxconn, said: "In working with Intrinsic, we are able to tap their deep expertise in AI-driven robotics. This synergy complements our global manufacturing leadership, enabling us to collaboratively unlock the factory of the future." Wendy Tan White, CEO of Intrinsic, said: “Together we’re working to bring the value of AI into the physical world. By marrying Intrinsic’s expertise in AI-driven robotics software – as well as Alphabet’s deep expertise in applied research and platform development – with Foxconn’s longstanding expertise with worldwide production, world-class facilities, and vision for the future of manufacturing, we will accelerate the adoption of AI where it is most needed and valuable today. The partnership with Foxconn provides an incredible opportunity to scale these solutions broadly.”   Dr. Zhe Shi, Chief Digital Officer of Foxconn, said: “Intrinsic has led the way when it comes to building an AI-integrated platform and AI-enabled robotic capabilities that can scale. In working together, we’ll be able to ensure Foxconn's Smart Manufacturing platform will enable intelligent automation fully across our factories, from data management to robotics, AI, and digital twins. This partnership will help revolutionize our factory operations, making them even more flexible, adaptable, skill-based, and scalable. From individual tasks at the robot level, to full production lines and plant management, we’re excited to be building the factory of the future together.”   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

21 November 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) and OpenAI today announced a collaboration focused on design work and U.S. manufacturing readiness for the next generation of AI infrastructure hardware. As part of this work, OpenAI will share insight into emerging hardware needs across the AI industry to help inform Foxconn’s design and development efforts for hardware to be manufactured at Foxconn’s U.S. facilities. While this initial agreement does not include purchase commitments or financial obligations, OpenAI will have early access to evaluate these systems and an option to purchase them. As AI capabilities continue to advance, so has the need for a new class of physical infrastructure that is purpose-built for the demands of advanced models. By combining OpenAI’s insight into the needs of today’s and future models with Foxconn’s manufacturing expertise, the companies will work together to strengthen domestic supply chains across the U.S. and accelerate the deployment of advanced AI systems. Building this infrastructure in the U.S. is essential to strengthening supply chains and supporting continued American leadership in AI. This new initiative will focus on three core efforts:  Designing for multiple generations of data center hardware: OpenAI and Foxconn will co-design, engineer, and develop multiple generations of AI data center racks in parallel to keep pace with rapidly advancing model needs. By combining OpenAI’s infrastructure roadmap with Foxconn’s engineering and manufacturing expertise, we can bring new systems online faster and secure capacity for long-term growth. Strengthening and simplifying the U.S. AI supply chain: Together, we will work to improve rack architecture so it can be manufactured across the U.S., broaden sourcing to include more chipsets and domestic suppliers, and expand localized testing and assembly. This will improve reliability, speed deployment, and strengthen the ecosystem, building a more resilient and scalable American supply chain. Building critical AI data center components in the U.S.: Foxconn will manufacture key equipment for AI data centers – including cabling, networking, cooling, and power systems – in the U.S. This will support the rapid construction of high-performance compute infrastructure and help ensure the economic benefits reach workers and manufacturers in order to meet the demands of AI workloads today and in the future.   “We at Foxconn are thrilled to partner with OpenAI – a pioneer at the forefront of the AI digital age,” said Foxconn Chairman Young Liu.  “As the world’s largest manufacturer of AI data servers, Foxconn is uniquely positioned to support OpenAI’s mission with trusted, scalable infrastructure that accelerates innovation and broadens access to transformative AI capabilities for businesses and users worldwide.”   “The infrastructure behind advanced AI is a generational opportunity to reindustrialize America,” said Sam Altman, CEO of OpenAI. “This partnership is a step toward ensuring the core technologies of the AI era are built here. We believe this work will strengthen U.S. leadership and help ensure the benefits of AI are widely shared.”   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

6 November 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) has signed a Memorandum of Understanding with Mitsubishi Electric Corporation to collaborate on the global supply of energy-efficient and highly reliable AI data center solutions. Under the MOU, the two companies will cooperate comprehensively in the field of AI data centers by utilizing the know-how and networks of both companies and supply competitive solutions for AI data centers with high efficiency and high reliability on a global basis, thereby contributing to solving social issues such as the realization of a circular economy. In the future, the two companies aim to jointly create new values, solutions and business models outside the AI data center field by leveraging their knowledge assets in the process of addressing social issues such as sustainability.About Mitsubishi Electric Corporation The Mitsubishi Electric Group is committed to contributing to the realization of a vibrant and affluent society through continuous technological innovation and unlimited creativity. We will realize sustainability by accelerating "Trade On" activities to develop our business while enriching society and the environment. We also utilize our Serendie ® digital platform to collect and analyze data obtained from customers in a digital space. We also promote circular digital engineering, which creates new value and contributes to solving social issues through strong connections within the Group and the sharing of knowledge. With a history of more than 100 years since its founding in 1921, the company has developed businesses including social systems, energy systems, defense and space systems, FA systems, automotive equipment, building systems, air conditioning and home appliances, digital innovation, and semiconductors and devices. With more than 200 Group companies and approximately 150,000 employees worldwide, consolidated sales in fiscal 2024 were 5,521.7 billion yen. For more information, visit www.MitsubishiElectric.co.jp   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

31 October 2025, Taipei, Taiwan – QunaSys, a leading innovator in quantum-chemistry      software with a Japan–Europe footprint, and      Hon Hai Research Institute, the      research arm of Hon Hai Technology Group (Foxconn), today announced the acceptance of their joint research paper “Neural Network Assisted Fermionic Compression Encoding: A Lossy-QSCI Framework for Scalable Quantum Chemistry Simulations” in Physical Review Research. This is the first major research achievement completed following the announcement in 2024 of the collaboration between the two parties to develop advanced fermionic encoding methods. The paper presents a new framework that combines advanced fermionic encoding with neural-network–assisted decoding to enable more efficient and scalable quantum chemistry simulations. Demonstrated on molecular systems, the method achieves chemical accuracy with fewer qubits and reduced computational overhead, opening a practical path toward applications on both near-term and fault-tolerant quantum hardware.In the core design of Lossy-QSCI, the RLE method developed by Hon Hai Research Institute effectively compresses the resources required for VQE calculations and enhances the efficiency of QSCI developed by QunaSys. This research focuses on the challenges of applying quantum computers to chemical simulations, as traditional approaches often require a large number of qubits and massive computational resources, far exceeding the capacity of existing quantum hardware. To address this issue, QunaSys proposed the Quantum Selected Configuration Interaction (QSCI) method, which was later extended by IBM into the Sampling-based Quantum Diagonalization (SQD) framework and successfully demonstrated on IBM’s quantum computer with a 76-qubit simulation. Although the experimental results were remarkable, the quantum advantage of QSCI over traditional computation methods rooted in chemical knowledge remained under scrutiny due to numerical challenges. To overcome this limitation, the joint research team leveraged patented results from Hon Hai Research Institute and introduced a novel “Fermionic Compression Encoding” framework, enhanced with machine-learning–assisted decoding. This approach effectively utilizes established chemical knowledge to compress the information content of molecular systems while maintaining simulation accuracy. In simple terms, it equips quantum computers with a “smart compression tool,” enabling them to perform more efficient and accurate chemical simulations with fewer resources. This breakthrough carries significant potential value for industries. In pharmaceuticals, it could accelerate the design of new drug molecules. In materials science and renewable energy, it can speed up the simulation and discovery of next-generation batteries, catalysts, and advanced materials. For the quantum industry, the framework helps address current hardware limitations, enabling near-term quantum computers to demonstrate more practical applications while laying the foundation for future fault-tolerant quantum systems. This study not only highlights the convergence of AI and quantum science but also provides a concrete and feasible pathway for bringing quantum computing into industrial applications. Looking Ahead QunaSys and Hon Hai Research Institute will continue to strengthen their collaboration by: ●   Identifying practical use cases where quantum algorithms can bring clear benefits to industry. ●    Developing novel quantum algorithms optimized for those use cases. ●     Working toward integration of these algorithms into real-world applications and product lines. Through these efforts, the two organizations aim to ensure that advancements in quantum research translate directly into industrial impact, helping accelerate the broader adoption of quantum technologies.   Physical Review Research, launched in 2019 by the American Physical Society (APS), is dedicated to publishing cutting-edge research across physics and interdisciplinary fields. Known for its broad scope and high visibility, the journal rapidly disseminates scientific advances worldwide. According to the latest Journal Citation Reports, it has an Impact Factor of approximately 4.5 and is ranked in the top 25% (Q1) of journals across physics and interdisciplinary categories, underscoring its strong and consistent influence.   Hon Hai Research Institute (HHRI), established in 2020 under the Hon Hai Technology Group, comprises five research institutes and one laboratory. Each unit is staffed by high-tech research professionals focused on forward-looking technologies over a three- to seven-year horizon, aiming to strengthen Hon Hai’s long-term technology and product innovation, support the Group’s shift toward being “intelligence-driven,” and enhance the competitiveness of Hon Hai’s “3+3+3” operating strategy.   QunaSys is a quantum-software company originating in Japan with a growing European presence. The company builds the QURI toolchain (SDK, VM, benchmarks) to prototype algorithms, estimate resources, and run reproducible workflows across simulators and quantum hardware—helping research and industry accelerate progress in chemistry and materials.

28 October 2025, Taipei, Taiwan and Washington, D.C. – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced it is collaborating  with NVIDIA, Stellantis and Uber to scale a collaborative development and deployment of Level 4 (hands-off, eyes-off) autonomous vehicles for robotaxi services on a global scale. Foxconn, the world’s largest electronics manufacturer and solutions provider, is bringing its expertise in high-performance computing, sensor integration, and electronic control systems to the partnership with NVIDIA, Stellantis, and Uber. In this collaboration, each partner contributes a unique strength: Foxconn’s hardware and integration know-how, NVIDIA’s advanced AI computing powered by NVIDIA DRIVE AGX Thor and the DRIVE AV software stack, Stellantis’ vehicle platforms, and Uber’s vast global network – forming a powerful alliance to advance autonomous mobility. These efforts center around developing Level 4-ready vehicles based on NVIDIA’s DRIVE AGX Hyperion 10 architecture, a reference compute and sensor platform that enables safe, scalable, and software-defined autonomous mobility. Foxconn Chairman Young Liu: “Autonomous mobility is a strategic priority within Foxconn’s EV program. The strategic partnerships and strengths across NVIDIA, Stellantis, and Uber accelerate the deployment of Level 4 robotaxi technology, with Foxconn delivering HPC, sensor integration to enable a global rollout.” NVIDIA Founder and CEO Jensen Huang: “Level 4 autonomy isn’t just a milestone for the auto industry – it’s a leap in AI capability. The vehicle becomes a robot – one that sees, perceives, plans, and drives with superhuman precision. By combining Stellantis’ global scale with NVIDIA DRIVE and Foxconn’s system integration, we’re creating a new class of purpose-built robotaxi fleets – making transportation safer, more accessible, and more affordable for everyone.” Stellantis CEO Antonio Filosa: “Autonomous mobility opens the door to new, more affordable transportation choices for customers. We have built AV-Ready Platforms to meet growing demand, and by partnering with leaders in AI, electronics, and mobility services, we aim to create a scalable solution that delivers smarter, safer, and more efficient mobility for everyone.” Uber CEO Dara Khosrowshahi: “NVIDIA is the backbone of the AI era and is now fully harnessing that innovation to unleash L4 autonomy at enormous scale, with Foxconn and Stellantis among the first to integrate NVIDIA’s technology for deployment on Uber. We are thrilled to work with Foxconn and Stellantis to bring the benefits of autonomous vehicles to millions of riders around the world.” Level 4 robotaxis require a sophisticated technology stack, including powerful computing, smart power management, reliable connectivity, and effective thermal control. They also rely on a wide assortment of sensors – such as LiDAR, radar, and multi-view cameras – working in concert to perceive the environment. In this collaboration, NVIDIA will develop and supply its NVIDIA DRIVE AV solutions built on the DRIVE AGX Hyperion 10 architecture, delivering Level 4 Parking and Level 4 Driving capabilities. Stellantis will design, engineer, and manufacture autonomous vehicles using its LCV platforms and STLA Small AV-Ready platforms, integrating NVIDIA DRIVE AV platform. Foxconn will partner with Stellantis on hardware and systems integration to ensure seamless vehicle architecture. Uber will operate the robotaxi services and expand its fleet with Stellantis-built, NDAS-powered vehicles, advancing autonomous mobility at scale.   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

28 October 2025, Taipei, Taiwan and Washington, DC – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) this week showcased, for the first time in the US capital, its latest smart manufacturing technologies being deployed across several states, and displayed the latest NVIDIA GB300 NVL72 AI infrastructure. At GTC Washington, DC – attended by many of the world’s largest electronics manufacturers and technology solutions providers – Foxconn signaled that the Group will continue to scale up AI server production across Texas, Wisconsin and California in partnership with NVIDIA to meet increasing customer demand. “Foxconn and NVIDIA share an excellent partnership. Our team is bringing the most advanced AI data center solutions to the United States, which will help our leading customers stay ahead in the AI race,” said Foxconn Chairman Young Liu, who participated in the keynote pregame broadcast for the second time this year. Attending GTC events, as well, was Foxconn Head of USA, Mexico and Canada, Jerry Hsiao, who is also a director of the DC-based National Association of Manufacturers (NAM), the largest industrial trade association in the United States, representing 14,000 member companies in every industrial sector in the US. With customer demand continuing to grow strongly, Foxconn has expanded its investments in AI server-related capabilities over the past year. Looking ahead, it will further evaluate the feasibility of expanding its investments based on industry trends and partnership opportunities. The Group’s strong R&D and integration capabilities in AI infrastructure also represents Taiwan’s critical role as a key hub in the global AI supply chain. Foxconn is currently working with NVIDIA in Houston to build a next-generation smart manufacturing plant for AI servers. The project leverages NVIDIA Omniverse libraries for upfront planning and scenario simulation to create an optimized factory environment – using NVIDIA AI physics framework,PhysicsNeMo, to develop an AI surrogate model for real-time thermal analysis, NVIDIA Isaac for AMR (Autonomous Mobile Robot) path planning, and NVIDIA Metropolis vision AI agents to monitor operations and enhance quality control. The factory will also be among the first to deploy humanoid robots powered by the NVIDIA Isaac GR00T N model on its production lines, as Foxconn and NVIDIA aim to build a world-leading benchmark AI smart factory. Foxconn has been in the US since 1985, with operations in the country comprising of more than 40 facilities across 12 states.

21, October 2025, Taipei, Taiwan – Hon Hai Research Institute (HHRI), an R&D powerhouse of Hon Hai Technology Group (“Foxconn”) (TWSE: 2317), the world’s largest electronics manufacturer and technology service provider, achieved a breakthrough in fault-tolerant quantum computing that was published in the prestigious scientific journal Nature Physics this month. The findings in the paper titled, “Constant-Overhead Magic State Distillation,” realizes the first optimal Magic State Distillation protocols, fixing the resource consumption for magic states at a level independent of the target output precision. This overcomes the long-standing bottleneck in previous protocols of fault tolerance quantum computation, where resources had to grow significantly as the target error rate decreased. The team, comprised of Min-Hsiu Hsieh, Director of the Quantum Computing Research Center at HHRI, together with HHRI researcher Adam Wills (now an MIT graduate student) and Prof Hayata Yamasaki from the University of Tokyo, utilized high-performance quantum codes, combined with transversal Clifford logical gates and efficient conversion mechanisms, ensuring that only a fixed number of input magic states are required to implement fault-tolerant T and CCZ gates—significantly enhancing the feasibility and efficiency of large-scale quantum computing. This technological breakthrough will strengthen Taiwan’s position in quantum computing and quantum error correction research, furthering HHRI’s commitment and excellence in quantum technologies. HHRI will continue advancing quantum computing research to contribute to global technological innovation and industrial progress. Nature Physics, a monthly peer-reviewed scientific journal, is one of the world’s most influential journal in the field of physics, publishing major breakthroughs and cutting-edge research. It boasts a high Impact Factor of 19.3, according to Journal Citation Reports. Acceptance by Nature Physics reflects exceptional scientific merit and substantial impact on the field. About Hon Hai Research Institute The institute, founded in 2020 and part of Hon Hai Technology Group (Foxconn), has five research centers. Each center has high technology R&D professionals, all of whom are focused on the research and development of new technologies, the strengthening of Foxconn’s technology and product innovation pipeline, efforts to support the Group’s transformation from "brawn" to "brains", and the enhancement of the competitiveness of Foxconn’s "3+3+3" strategy.

14 October 2025, San Jose, California – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced it is collaborating with NVIDIA to implement the 800 VDC power architecture for AI factories announced at Computex 2025, marking the next step toward modern AI factory infrastructure. Foxconn’s subsidiary Ingrasys Technology showcased the latest NVIDIA GB300 NVL72 platform, integrated with an In-row CDU solution to achieve new levels of energy efficiency. Through continuous innovation in high-efficiency power and thermal design, Foxconn reinforces its leadership and highlights Taiwan’s pivotal role in the global AI supply chain. The new architecture will first be implemented in the Kaohsiung K-1 artificial intelligence data center project, which serves as a demonstration site for the Group’s capabilities in AI servers, data centers and renewable-energy integration and further solidifies Taiwan’s strategic position in the global AI supply chain. The latest collaboration between the bellwether technology partners, announced at the OCP Global Summit 2025 where Foxconn subsidiary Ingrasys also unveiled its latest NVIDIA GB300 NVL72 platform, highlights the Group’s commitment to deliver safer, more energy-efficient, and rapidly deployable AI factory and data center solutions. The 800 VDC power architecture is purpose-built for high-density AI workloads. It features a modular and scalable design that significantly reduces current and resistive losses, minimizes conductor usage, and simplifies power distribution – while improving energy-conversion efficiency and system safety. It also supports multiple future generations of NVIDIA Infrastructure platforms platforms, providing a reliable, efficient, and sustainable power foundation to meet the demands of next-generation AI computing. In addition, Foxconn’s subsidiary Ingrasys Technology also showcased a lineup of next-generation AI solutions, including NVIDIA GB300 NVL72, NVIDIA HGX B300 platform, and the new NVIDIA MGX servers designed for enterprise-grade AI applications. These innovations highlight Foxconn’s strong capabilities in AI infrastructure development, and system integration. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

26 August 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is adopting NVIDIA RTX PRO Servers, an enterprise level data center infrastructure accelerated by NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs. Foxconn will use NVIDIA RTX PRO Servers to accelerate GenAI deployment, agentic workflow design and simulation applications. “Achieving digital transformation in smart manufacturing requires the right foundation and technology. By introducing NVIDIA RTX PRO Servers into our global infrastructure, Foxconn is redefining the boundaries of AI-driven automation – from sophisticated robotics to intelligent logistics, agentic factory operations and smart electric vehicles,” said Young Liu, CEO and Chairman of Foxconn. Foxconn is deploying multiple use cases on RTX PRO Servers, including NVIDIA Omniverse for 3D digital twins to plan and simulate automated production lines, and NVIDIA Isaac for development and simulation of advanced autonomous mobile robots (AMRs). RTX PRO Servers are also featured in the NVIDIAEnterprise AI Factory validated design, empowering Foxconn to rapidly deploy full-stack, enterprise-grade AI infrastructure. Paired with NVIDIA BlueField-3 DPUs and NVIDIA ConnectX-8 SuperNICs, it integrates high-efficiency networking, storage, and cybersecurity accelerators to support a wide range of enterprise applications, including: ●      Industrial AI and robotics simulation (physical AI) ●      Generative AI and LLM inference (agentic AI) ●      Scientific computing and data analytics ●      Industrial design and real-time rendering This will be particularly valuable for Foxconn in advancing smart manufacturing, digital twins, and supply chain optimization. “Modern factories will exist in two worlds: one physical, one digital—perfect twins that look and behave the same,” said Jensen Huang, founder and CEO of NVIDIA. “NVIDIA RTX Pro is the platform of this revolution, built on simulation, graphics, and AI. Foxconn is leading the way, reinventing manufacturing for the era of AI and Omniverse digital twins.” RTX PRO Servers are expected to greatly boost Foxconn development efficiency and edge AI deployments, enabling multiple high-precision simulations to run in parallel and instantly see how different strategies perform. These systems provide Foxconn confidence to explore more complex scenarios and quickly identify the best solutions. For robotics and a wide range of AI applications, this means a smoother, faster path from concept to deployment. Foxconn is also an NVIDIA system partner and offers RTX PRO Servers through its Ingrasys business, based on the MGX reference design with 8 RTX PRO 6000 Blackwell GPUs: http://www.ingrasys.com/solutions/NVIDIA/nvidia_mgx_systems/Read more: http://nvidianews.nvidia.com/news/industry-leaders-transform-enterprise-data-centers-for-the-ai-era-with-nvidia-rtx-pro-servers About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

22 August 2025, Taipei, Taiwan – Mitsubishi Fuso Truck and Bus Corporation (MFTBC) and Hon Hai Technology Group (“Foxconn”) (TWSE:2317) have signed a memorandum of understanding to explore strategic collaboration in zero emission buses, accelerating clean mobility for the Japanese commercial vehicle powerhouse and the world’s largest electronics manufacturer.As part of the collaboration that will strengthen the FUSO bus business, the two companies via their subsidiaries – Mitsubishi Fuso Bus Manufacturing Co., Ltd. (MFBM) and Foxtron Vehicle Technologies (TWSE:2258) – will cooperate in the development, production, supply chain management, and sales of ZEV buses, beginning with Foxtron-developed MODEL T and MODEL U.The four companies will use the MOU as a starting point to investigate future business models aimed at strengthening the FUSO brand and developing new, made-in-Japan buses. Through this initiative, the companies will provide products that meet a wider range of needs in the rapidly evolving bus market and achieve sustainable business growth.MFBM will serve as the operations platform for the development, production, and commercialization of buses in target markets, including exploring the introduction of made-in-Japan ICE and ZEV buses into target markets.With a track record in performance and safety, the award-winning, full-size MODEL T is already operating commercially as part of the public transit systems in Taiwan’s biggest cities. Universal and intelligent in mid-size mobility, MODEL U’s clean and simple appearance emphasizes flexibility and multi-functionality. About Mitsubishi Fuso Truck and Bus CorporationMitsubishi Fuso Truck and Bus Corporation (MFTBC) is a commercial vehicle manufacturer based in Kawasaki City, Japan. 89.29% of its shares are owned by Daimler Truck AG and 10.71% by various Mitsubishi group companies. MFTBC provides trucks, buses and industrial engines under the FUSO brand with a longstanding history of over 90 years, serving approximately 170 markets worldwide. MFTBC proactively develops cutting-edge technologies such as electrification, with its eCanter being Japan’s first mass-produced electric light-duty truck. MFTBC’s heavy-duty Super Great Truck was also the first of its kind in Japan to include SAE Level 2-equivalent automated driving support technology, now a benchmark in the Japanese commercial vehicle market.